Thermaly mechanisms in electrostaticaly actuated microelectromechanical structures

The paper reports results of the performed research work related to the deformations and stability of Al-Si parallel-plate electrostatic microactutors fabricated on silicon-on-insulator (SOI) wafer and subjected to uniform temperature changes. Presented research includes measurements of the deformation of Si beam with deposited Al thin-film microstructures as a function of temperature changes using Electronics Speckle Pattern Interferometry (ESPI) and a custom-built thermal module that is covered by optical beam splitter window to allow optical access